Aehr Test Systems Propiedad de la dirección

¿Qué es el Propiedad de la dirección de Aehr Test Systems?

El Propiedad de la dirección de Aehr Test Systems es 8.21%

¿Cuál es la definición de Propiedad de la dirección?



La propiedad de personas con información privilegiada se calcula como el número total de acciones propiedad de personas con información privilegiada (accionistas que poseen más del 5% de la corporación o un funcionario o director de la compañía) dividido por el total de Acciones en circulación.

A high value of insider ownership means that those working for the company have a large stake in the success of the company. This is sometimes seen as a sign that those running the company will work hard to ensure its success or believe the company's stock price will rise.

A change in insider ownership may come from exercise of option, stock grant and buying or selling of company shares. A purchase of company share signifies a confidence in the company's future performance by people who know the company best. Therefore, Net Insider buying is also an important indicator for investors.

Propiedad de la dirección de compañías en Sector Technology en NASDAQ en comparadas con Aehr Test Systems

¿Qué hace Aehr Test Systems?

headquartered in fremont, california, aehr test systems is a worldwide supplier of systems for burning-in and testing memory and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. aehr test has developed and introduced several innovative products, including the abts, foxtm and max systems and the diepak® carrier. the abts system is aehr test’s newest system for packaged part test during burn-in for both low-power and high-power logic as well as all common types of memory devices. the fox system is a full wafer contact test and burn-in system. the max system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. the diepak carrier is a reusable, temporary package that enables ic manufacturers to perform cost-effective final test and burn-in of bare die.

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