Aehr Test Systems SMA 50

¿Qué es el SMA 50 de Aehr Test Systems?

El SMA 50 de Aehr Test Systems es $16 -20.00%

¿Cuál es la definición de SMA 50?

SMA 50 es un precio promedio de las acciones de los últimos 50 días calculado como una media no ponderada de los previos 50 precios de cierre de acciones.

Simple moving average of 50 days for a stock is an unweighted moving average over the past 50 days. Moving averages will always exhibit a lag and the longer the period used for averaging the greater the lag will be. Because of the large amounts of data considered when calculating a long-term moving average, it takes a considerable amount of movement in the market to cause the moving average to change its course.

Using a moving average to confirm a trend in price is one of the most basic, yet effecting ways of using the indicator. Moving averages take into account what has already happened and a whole range of past events, which makes them such a good technical analysis tool for trend confirmations. Generally, a long-term moving average that is clearly on the upswing is a confirmation of a bullish trend. Conversely, a long-term moving average that is clearly on the downswing is a confirmation of a bearish trend.

¿Qué hace Aehr Test Systems?

headquartered in fremont, california, aehr test systems is a worldwide supplier of systems for burning-in and testing memory and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. aehr test has developed and introduced several innovative products, including the abts, foxtm and max systems and the diepak® carrier. the abts system is aehr test’s newest system for packaged part test during burn-in for both low-power and high-power logic as well as all common types of memory devices. the fox system is a full wafer contact test and burn-in system. the max system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. the diepak carrier is a reusable, temporary package that enables ic manufacturers to perform cost-effective final test and burn-in of bare die.

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